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ENGINEER, PRODUCT QE_PQA2 PARAM/WLR

Taichung - Fab 16, Taiwan💼 Full-time🗓 2026-06-22 → 2026-07-31

Core

Lead quality engineering for semiconductor memory products, managing reliability, failure analysis, and process improvement from NPI through HVM phases.

Role type

Senior Product Quality Engineer (Semiconductor Manufacturing)

Builds

High-performance DRAM, NAND, and NOR memory and storage products

Domain

Semiconductor manufacturing and reliability engineering

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

semiconductor device physics, statistical data analysis, failure analysis, root cause analysis, FMEA, 8D processes, reliability specification analysis, wafer burn-in monitoring, RMA management, CAPA development, team leadership

Preferred skills

CMOS or silicon based memory device knowledge, semiconductor process flow expertise, data mining techniques

Technologies

DRAM, NAND, NOR memory technologies, wafer level burn-in systems, global quality dashboards

Responsibilities

Manage MRB cases and postmortems for CAPA enhancement; monitor wafer level burn-in and shift left to probe; manage RMA analysis for process improvement; develop WLR and PARAM programs for fab process reliability; oversee outgoing quality control for wafer surface and pad defects; lead new product management and customer sample delivery; drive quality metrics improvements including OQRM and RMAs; monitor global quality dashboards and report reliability metrics; lead the NPI_WLR team with performance objectives and training plans

Seniority

Senior, hands-on IC with team management responsibilities

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