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Engineer, Shift Process, Real Defect Analysis & Metrology

Fab 10N/X, Singapore💼 Full-time🗓 2026-06-09 → 2026-07-31

Core

Optimizing RAM tool performance, managing lot disposition, and analyzing measurement data to ensure accurate completion of metrology and Real Defect Analysis (RDA) processes without quality issues.

Role type

Shift process engineer (metrology & RDA)

Builds

High-performance DRAM, NAND, and NOR memory and storage products

Domain

Semiconductor manufacturing / Memory and storage

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Metrology tool operation, RDA process management, tool optimization, GR&R analysis, operational metrics tracking, shift work adaptability

Preferred skills

Experience with CDSEM, KLA, AFM, E-beam tools

Technologies

CDSEM, KLA, AFM, E-beam

Responsibilities

Support smooth operations of RAM lots and tools; Manage lot disposition and tool operations; Collaborate with HVM RAM teams to align with metrology and RDA processes; Coordinate training for operations team on procedures and best-known methods; Track operational performance metrics and implement continuous improvement; Perform basic analysis of measurement data including GR&R; Adhere to safety procedures and area work rules

Seniority

Mid-level, hands-on IC

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