Real Time Defect Analysis Engineer
Core
Identify, diagnose, and resolve process-related problems in semiconductor frontend fabrication to improve product quality, yield, and reliability.
Role type
Process and equipment engineer (semiconductor manufacturing)
Builds
High-performance DRAM, NAND, and NOR memory and storage products
Domain
Semiconductor manufacturing (frontend fabrication)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Failure analysis, Failure Mode & Effects Analysis (FMEA), Statistics Process Control (SPC), root cause analysis, process optimization, equipment evaluation, material evaluation, yield improvement, cost reduction, risk management
Preferred skills
None stated
Technologies
None stated
Responsibilities
Establish and improve process condition and technology; Upgrade process capability and reduce production cost; Evaluation, promotion and planning of new equipment / materials; Abnormal analysis and improvement; Maximizes yield by working on tools, the process, or wafer fabrication recipes; Troubleshoots wafer fabrication problems and performs root cause analysis; Works with other process areas to understand and control process deviations; Long-term investigation of defect issues; Evaluates products to ensure they meet required design and performance specifications; Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes
Seniority
Individual Contributor (IC), mid-level to senior
