MTB PWF DEBOND Equipment Engineer
Core
Installation, maintenance, and process optimization of semiconductor debond equipment to ensure product quality and yield.
Role type
Equipment Engineer (Semiconductor Manufacturing)
Builds
Semiconductor memory and storage products (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing / Hardware engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Equipment maintenance, process parameter setup, abnormal analysis, process improvement, tool capability upgrade, new equipment evaluation
Preferred skills
Production line experience (3+ years), Bachelor's degree or higher
Technologies
Semiconductor debond equipment, process management systems
Responsibilities
Install and sustain debond equipment, perform basic maintenance on bond area equipment, establish and improve process conditions, upgrade tool capabilities, set up process parameters for semiconductor equipment, evaluate new equipment and materials, conduct abnormal analysis and drive improvements
Seniority
Mid-level, hands-on IC