Senior Hardware Technical Lead, Interconnect Systems
Core
Lead end-to-end technical program execution for Co-Packaged Optics (CPO) and Silicon Photonics (SiPho) interconnect hardware, from concept through mass production.
Role type
Senior Hardware Technical Lead (Interconnect Systems)
Builds
Advanced test solutions for high-speed electro-optical devices powering AI data centers
Domain
Semiconductor / Electro-optics / Silicon Photonics
Required skills
Hardware system engineering, Electro-optical characterization, Program management, Python scripting, Test automation, Failure analysis, Electrical/Optical debug, DFM/DFT guidelines, Cross-functional leadership
Preferred skills
Co-Packaged Optics system integration, Silicon photonics device characterization, Opto-mechanical design, Overseas manufacturing collaboration
Technologies
Python, JMP, I2C, SPI, JTAG, Oscilloscopes, Spectrum analyzers, OPMs, BER testers, Source meters
Responsibilities
Drive full program lifecycle from requirements to HVM release; Act as technical focal point across multi-disciplinary workstreams; Mentor engineers and conduct design reviews; Consolidate requirements into plan of record; Define and execute validation/coverage strategy; Perform hands-on electrical and optical debug and failure analysis; Develop automation solutions for test and production; Partner with manufacturing to improve yield and reduce test time.
Seniority
Senior, hands-on IC with leadership dimension