Space Electronics Packaging and Mechanical Product Design and Analysis Engineer (Subject Matter Expert)
Core
Lead mechanical design, structural/thermal analysis, and electronics packaging for satellite missions and space electronics.
Role type
Senior IC mechanical engineer (space electronics packaging and analysis)
Builds
Satellite subsystems, multichip modules, and electronic systems for space exploration
Domain
Aerospace / Space Systems / Electronics Packaging
Required skills
Structural design, thermal analysis, vibration analysis, CAD (Creo, SolidWorks, Siemens NX), PCB layout, FEA, root cause analysis, trade studies
Preferred skills
ANSYS, MSC Patran, COMSOL Multiphysics, team leadership, emerging technology investigation
Technologies
Creo, SolidWorks, Siemens NX, ANSYS, MSC Patran, COMSOL Multiphysics
Responsibilities
Lead multi-discipline coordination for design requirements; perform structural and thermal analysis; collaborate on PCB sizing and placement; validate designs via testing and review; develop process improvements; conduct root cause analysis; track technical performance measures; investigate emerging technologies
Seniority
Senior, hands-on IC with leadership potential