Subject Matter Expert Electronics Design and Analysis Engineer (Electronic Packaging Design)
Core
Lead multi-discipline coordination and detailed structural/thermal analysis for space electronics packaging and mechanical product design.
Role type
Senior IC mechanical/electronics packaging engineer
Builds
Satellite missions, multichip modules, and electronic systems for space exploration
Domain
Aerospace / Space Electronics / Mechanical & Thermal Engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Structural design, Thermal analysis, Vibration analysis, CAD design, PCB layout, Root cause analysis, Process improvement, Trade studies, Supplier management
Preferred skills
ANSYS, Creo CAD, SolidWorks, FEA, Siemens NX Nastran, MSC Patran, COMSOL Multiphysics, Team leadership
Technologies
ANSYS, Creo, SolidWorks, Siemens NX Nastran, MSC Patran, COMSOL
Responsibilities
Lead coordination of multi-discipline groups to develop high-level and detailed designs; Perform trade studies to optimize structure; Conduct detailed structural and thermal analysis using hand calculations and tools; Collaborate with Electrical Engineering for PCB sizing, placement, layout, and routing; Validate designs through review, testing, and analysis; Develop and support new engineering processes; Conduct Root Cause and Corrective Action investigations; Investigate emerging technologies for future product concepts.
Seniority
Senior, hands-on IC