HBM EQUIPMENT ENGINEER
Core
Evaluate and optimize manufacturing processes, lead equipment selection and implementation, and drive qualification and ramp-up of new process equipment for semiconductor manufacturing.
Role type
Senior IC equipment engineer (semiconductor assembly)
Builds
Semiconductor memory and storage products (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing / Hardware engineering
Required skills
Semiconductor equipment operation and maintenance, Wafer level molding/dicing/thinning/mount/debond, Root cause analysis, Continuous improvement, Automation and smart monitoring systems, Tool installation/setup/buyoff procedures, FDC/Tool alarm analysis, Tool signal understanding (SVID, CEID, ECID)
Preferred skills
AI application in job tasks, English communication (TOEIC 600+)
Technologies
Semiconductor assembly tools, FDC systems, Smart monitoring systems
Responsibilities
Evaluate and optimize manufacturing processes, Lead equipment selection and implementation, Drive qualification and ramp-up of new process equipment, Collaborate with process, quality, procurement, and vendor teams, Lead root cause analysis of equipment issues, Implement automation and smart monitoring systems
Seniority
Mid-level, hands-on IC