Sr Engineer, APTD Data Integration
Core
Data integration engineer driving AI transformation and integrated solutions for HBM product development within Advanced Packaging Technology Development (APTD), extracting and analyzing data to improve yield, throughput, and reliability.
Role type
Senior IC data integration engineer (AI/ML focus)
Builds
Integrated data solutions, automated ETL/analytics jobs, visualization reports for HBM product development
Domain
Semiconductor manufacturing / High Bandwidth Memory (HBM)
Deliverable
production ML models
Required skills
Generative AI and foundation model platforms, Cloud platforms (GCP/AWS/AZURE), Database management (Oracle/MSSQL/Snowflake), Python/C#/Matlab/R programming, Data visualization (Tableau/Power BI), ETL development, Cross-functional collaboration
Preferred skills
Semiconductor Device Physics, Fabrication, Assembly and Test knowledge
Technologies
OpenAI, Anthropic Claude, Google Gemini, Microsoft Azure AI, GCP, AWS, AZURE, Oracle, MSSQL, Snowflake, Tableau, Power BI, Python, C#, Matlab, R
Responsibilities
Work cross-functionally with PIE, PE, MRDA, IT, Smart Manufacturing, Process Control, and Equipment teams to develop integrated solutions; Drive AI transformation by implementing generative AI solutions; Extract, monitor, and analyze inline, test, and tools data to improve yield and performance; Develop prototype solutions including automated ETL and analytic jobs; Summarize complex problems and drive team execution with defined milestones
Seniority
Senior, hands-on IC
