New College Grad Process Engineer – Diffusion/Implant/Rapid Thermal Process
Core
Own and sustain Diffusion, Implant, and/or Rapid Thermal Processing (RTP) processes in high-volume semiconductor manufacturing to ensure yield, quality, and productivity.
Role type
Process Engineer (Semiconductor Manufacturing)
Builds
High-volume memory and storage chips
Domain
Semiconductor manufacturing / Materials Science
Required skills
Semiconductor fabrication processes, Device physics, Statistical Process Control (SPC), Root cause analysis (5-Why, 8D), Design of Experiments (DOE), Data analysis, Cleanroom operations
Preferred skills
Diffusion/Ion Implantation/RTP experience, Equipment qualification, Manufacturing control systems (FDC), Cross-functional collaboration
Technologies
SPC, FDC, DOE, AI-enabled workflows
Responsibilities
Monitor process parameters and recipes, investigate process excursions, improve process capability and yield, support new equipment installations, maintain process documentation
Seniority
Entry-level (0-2 years experience)