SR ENGINEER, PDE METRO RDA
Core
Manage advanced inspection and metrology platforms, drive equipment lifecycle management, and develop data analytics solutions for semiconductor packaging.
Role type
Senior IC equipment engineering and data analytics lead
Builds
Inspection/metrology tool networks, defect detection systems, and manufacturing data platforms
Domain
Semiconductor manufacturing / Advanced Packaging / Metrology
Deliverable
production ML models | dashboards & analysis
Required skills
Semiconductor equipment qualification, technology roadmap planning, data governance, supplier management, NPI readiness, defect analysis, AI/analytics integration, cross-functional program leadership
Preferred skills
Advanced packaging domain expertise, AI/automation implementation
Technologies
AI, analytics platforms, automated workflows, MRDA data systems
Responsibilities
Manage inspection and metrology platforms throughout package development; Develop technology roadmaps and capability strategies; Lead tool installation, qualification, and production readiness; Develop inspection solutions to detect and reduce critical defect mechanisms; Manage and improve MRDA data systems and engineering applications; Support technology development programs in HBM and Advanced Packaging; Collaborate with equipment suppliers to resolve technical issues and introduce next-generation technologies
Seniority
Senior, hands-on IC with program management