CareerPlan

New Product Introduction Operations

Penang, Malaysia - GrandeFull-time2026-10-13 → 2026-11-10

Core

Lead end-to-end manufacturing and fulfillment execution for complex new-product sample demand across DDR, LPDDR, CXL-attached DRAM, GDDR, and HBM-based memory products.

Role type

Senior IC NPI Operations Product Lead

Builds

New product samples and qualification builds for memory solutions

Domain

Semiconductor manufacturing and supply chain

Required skills

Semiconductor manufacturing flow knowledge, WIP and yield management, global cross-functional coordination, supply chain planning, logistics and customs compliance, data analytics, operational discipline

Preferred skills

Memory product experience, SAP/Teamcenter/Power BI proficiency, AI-enabled tools for supply visibility

Technologies

SAP, Teamcenter, Power BI

Responsibilities

Translate customer sample demand into executable build and fulfillment plans, track manufacturing progress against committed dates, partner with planning and manufacturing teams to drive recovery for holds and yield issues, coordinate with supply chain and logistics to remove order blocks, establish blocker management expectations with named owners, maintain end-to-end visibility from demand to shipment, provide fact-based status on delivery risk and recovery plans, create disciplined regional handoffs, use analytics to improve supply visibility and reduce manual reporting, drive process improvements for build-to-ship velocity

Seniority

Senior, hands-on IC