Engineer, MTB PCE
Core
Perform material characterization, develop testing methods, lead supplier quality investigations, and conduct failure analysis for semiconductor packaging materials.
Role type
Senior IC materials engineer (semiconductor packaging)
Builds
Material qualification protocols, supplier quality control systems, and failure analysis reports for molding compounds and packaging materials
Domain
Semiconductor manufacturing / Materials Science
Required skills
DSC, TGA, DMA, TMA, Rheometer, Contact Angle, Density analysis, Root cause analysis, DOE design, Statistical analysis, MSA plans, SOP development, Supplier quality management
Preferred skills
AI-driven quality monitoring, Data science tools, Cross-functional collaboration, Digital transformation initiatives
Technologies
DSC, TGA, DMA, TMA, Rheometer, MSA, SPC, DOE, AI tools
Responsibilities
Perform material characterization using analytical techniques, Develop and standardize testing methods, Lead supplier material investigations, Investigate material-related failures, Design and execute DOE studies, Support new material qualifications and production ramp-ups
Seniority
Senior, hands-on IC
