Equipment Engineer (CMP)
Core
Maintain, troubleshoot, and optimize advanced wafer fabrication equipment to improve tool reliability, yield, productivity, and cost of ownership in a 300mm semiconductor manufacturing facility.
Role type
Senior IC Equipment Engineer (CMP)
Builds
High-volume memory and storage solutions for AI, 5G, cloud computing, and autonomous vehicles
Domain
Semiconductor manufacturing (300mm wafer fab)
Required skills
Semiconductor manufacturing experience, troubleshooting, analytical problem-solving, SPC, FDC, statistical analysis, data-driven decision making
Preferred skills
CMP equipment support (EBARA 300X, Applied Materials LKP), equipment installation/qualification, maintenance strategy development, yield improvement methodologies, defect reduction, process optimization, vendor management
Technologies
EBARA 300X, Applied Materials LKP (LK Prime), SPC, FDC
Responsibilities
Maintain and optimize semiconductor manufacturing equipment for high-volume production; Troubleshoot equipment issues using structured problem-solving methods (8D, FMEA, SPC, root cause analysis); Support tool installations, qualifications, upgrades, and process integration; Drive equipment uptime, reliability, throughput, and yield improvements; Lead continuous improvement and cost reduction projects; Analyze equipment and process data to identify performance gaps and corrective actions
Seniority
Senior, hands-on IC
