Senior/Principal Eng, FE OCT CPEE PHOTO METROLOGY
Core
Lead HVM photo/overlay metrology yield, quality, productivity, and cost improvement initiatives while resolving complex issues through data-driven root-cause analysis.
Role type
Senior/Principal IC semiconductor metrology engineer
Builds
High-volume manufacturing (HVM) and New Product Introduction (NPI) memory and storage solutions
Domain
Semiconductor manufacturing (photolithography)
Required skills
photo/overlay metrology engineering, yield improvement, root-cause analysis, Best Known Methods (BKM) deployment, cross-fab alignment, supplier management, data-driven problem solving
Preferred skills
AI tool integration, global team collaboration, business travel
Technologies
photo/overlay metrology tools, reticle correction, destack, MMM
Responsibilities
Lead HVM photo/overlay metrology yield, quality, productivity, and cost improvement initiatives; Resolve complex photo/overlay metrology issues through data-driven root-cause analysis; Define and deploy photo/overlay metrology Best Known Methods (BKM) across fabs for HVM and NPI; Act as the technical point for cross-fab, complex photo/overlay metrology customer concerns; Drive MOR–POR gap closure and cross-fab/node alignment in collaboration with internal teams and suppliers; Influence key suppliers and represent OCT in reviews, workshops, and governance forums
Seniority
Senior/Principal, hands-on IC