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Engineering Execution Manager, HIG High Bandwidth Memory (HBM)

Fab 10A, Singapore💼 Full-time🗓 2026-09-04 → 2026-09-26

Core

Guide HBM products through concept, design, NPI, and HVM phases by facilitating cross-functional life-cycle management and driving tactical execution.

Role type

Senior IC Engineering Execution Manager (HBM)

Builds

High Bandwidth Memory (HBM) solutions for Machine Learning and AI applications

Domain

Semiconductor manufacturing / Memory and storage / AI infrastructure

Deliverable

product features

Required skills

Cross-functional team leadership, Product lifecycle management, Schedule and milestone planning, Risk analysis, Stakeholder communication, Resource allocation, Project management tool proficiency, Hardware readiness planning

Preferred skills

Data analysis and visualization, Process improvement mindset

Technologies

JIRA, Confluence

Responsibilities

Integrate HBM development across extended teams and partners; Partner with Technology, Design, Process, and Manufacturing teams to drive progress; Collaborate with PMO to build and maintain development schedules; Communicate development status, priorities, and challenges; Set and prioritize tactical expectations across activities; Consolidate inputs for hardware readiness and capacity planning

Seniority

Senior, hands-on IC

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