HBM ASSY EQUIPMENT ENGINEER
Core
Establish, optimize, and sustain equipment process conditions for stable semiconductor manufacturing operations, specifically focusing on HBM assembly equipment.
Role type
Senior IC equipment engineer (semiconductor assembly)
Builds
Semiconductor memory and storage products (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing / Hardware engineering
Deliverable
production ML models | product features
Required skills
Equipment process optimization, root cause analysis, troubleshooting, continuous improvement, AI-powered monitoring, predictive analytics, data analysis, cross-functional collaboration
Preferred skills
Production line integration, manufacturing operations, material management
Technologies
Microsoft Copilot, AI-assisted engineering tools, AI-driven insights
Responsibilities
Set up and optimize process parameters for semiconductor assembly and inspection equipment; Lead abnormal event analysis and corrective actions; Evaluate and plan new equipment and automation solutions; Utilize AI tools to improve equipment reliability and reduce downtime; Analyze manufacturing data to identify performance trends and optimization opportunities.
Seniority
Mid-level, hands-on IC