Sr Engineer, CVD/DIFF DRAM
Core
Lead the development of advanced thin-film processes for future DRAM technologies, driving innovations from concept through high-volume manufacturing.
Role type
Sr IC process engineer (thin-film deposition)
Builds
Next-generation DRAM products
Domain
Semiconductor manufacturing / Memory
Deliverable
production ML models
Required skills
Thin-film deposition process design, DOE design and analysis, reaction engineering, thermodynamics, transport phenomena, plasma science, statistical process control (SPC), materials and surface characterization (XPS, AFM, XRD, AES, EBSD, SIMS)
Preferred skills
Tool parameter optimization, DRAM/HPCMOS/EUV technology support, AI/ML for engineering workflows
Technologies
XPS, AFM, XRD, AES, EBSD, SIMS
Responsibilities
Translate DRAM product requirements into scalable thin-film process solutions; Develop, optimize, and characterize thin-film deposition processes; Identify and resolve process defects, yield issues, and reliability risks; Design and implement DOE and analyze results; Partner with equipment and materials suppliers to evaluate new tools and chemistries; Develop, implement, and monitor quality control plans using SPC techniques.
Seniority
Senior, hands-on IC