Staff Engineer, HIG-HBM Product Engineering (Media Health Reliability)
Core
Define and develop reliability stress test flows and plans for HBM products, driving down defect rates through optimized manufacturing test strategies and root cause analysis.
Role type
Staff Engineer, HBM Product Engineering (Media Health Reliability)
Builds
HBM memory products used in VR, neural networks, data centers, and AI applications
Domain
Semiconductor manufacturing / High Bandwidth Memory (HBM) / Reliability Engineering
Required skills
Reliability test flow development, Electric Failure Analysis (EFA), Physical Failure Analysis (PFA), Root cause analysis, Process conversion strategy, Risk management, Cross-functional collaboration, AI strategy for reliability, Applied machine learning (regression, classification, anomaly detection, clustering), Python scripting, CMOS technology knowledge, DRAM architecture understanding
Preferred skills
Semiconductor device physics, JMP usage, Data analysis and statistics, Mentorship of engineers
Technologies
Python, JMP, Claude code, Agentic AI
Responsibilities
Define and develop reliability stress test flows and plans; Drive down Extrinsic and Intrinsic Reliability (DPM) through optimized manufacturing test flows; Debug and identify root causes of device issues using EFA and PFA; Provide recommendations to fab teams for new process conversions to reduce cost and increase yields; Manage risks associated with DPM process conversions; Promote innovation and drive technical advantages; Coach engineers on AI adoption and embed AI/automation into reliability workflows
Seniority
Staff, hands-on IC with mentorship responsibilities
