Intern - TEM Engineer
Core
Intern role focused on advanced semiconductor sample preparation for Transmission Electron Microscopy (TEM) analysis using Dual Beam Focused Ion Beam (FIB) systems and AI-enabled process innovation.
Role type
Intern TEM Engineer (Semiconductor Failure Analysis)
Builds
Semiconductor sample preparation workflows and AI-enhanced laboratory processes
Domain
Semiconductor manufacturing / Materials characterization
Deliverable
physical/clinical work
Required skills
Materials Science/Physics/Chemistry fundamentals, FIB operation principles, TEM sample preparation, analytical thinking, data analysis tools
Preferred skills
Familiarity with FIB/TEM concepts, interest in Generative AI/LLMs for engineering workflows
Technologies
Dual Beam FIB systems, AI tools, LLMs
Responsibilities
Prepare semiconductor samples for TEM characterization, apply FIB-based sample preparation techniques, collaborate with engineering stakeholders on characterization objectives, investigate advanced FIB methodologies, document project observations and technical learnings
Seniority
Intern