Staff/ Principal Engineer, FE OCT Spares Engrg
Core
Lead and execute spares engineering programs to drive operational and cost efficiency in semiconductor manufacturing, managing test wafer utilization and global strategy for spares lifetime and consumption reduction.
Role type
Staff/Principal Engineering Program Manager (Semiconductor Manufacturing)
Builds
Operational efficiency programs, test wafer planning processes, and global spares strategies for memory and storage solutions.
Domain
Semiconductor manufacturing (DRAM, NAND, NOR) and supply chain operations.
Required skills
Engineering program management, demand planning, data analysis, cross-functional collaboration, process improvement, stakeholder management, global strategy execution, supplier collaboration, travel management.
Preferred skills
Spare parts management, equipment engineering, Lean/Six Sigma methodologies, data visualization tools (Excel, Power BI), test wafer management, fab cost control, wafer process flow understanding.
Technologies
Excel, Power BI, semiconductor test equipment, fab planning systems.
Responsibilities
Lead and execute spares engineering programs to drive operational and cost efficiency; Analyze metrics and demand trends to identify and act on improvement opportunities; Coordinate with process and equipment engineering teams to optimize test wafer usage and minimize waste; Lead analysis and benchmarking efforts with competitors from Spares and Test Wafer front; Collaborate cross-functionally with engineering, operations, supply chain, and leadership teams; Travel to multiple sites or Supplier locations as required to support program execution.
Seniority
Staff/Principal, hands-on IC with strategic oversight.