Ingénieur en Packaging mécanique et thermique-Equipements Spatiaux (h/f)
Core
Lead mechanical and thermal packaging design for high-complexity electronic equipment in extreme space environments.
Role type
Senior IC mechanical packaging engineer (space systems)
Builds
Robust electronic subsystems for space missions
Domain
Aerospace / Space Systems / Electronics
Required skills
mechanical design under severe constraints, thermal management, multi-physics constraint management, PCB design supervision, FEA simulation, manufacturing process knowledge
Preferred skills
electromagnetic compatibility (EMC) robustification, high-reliability assembly processes
Technologies
FEA, PCB design tools, mechanical CAD
Responsibilities
Pilot physical design of complex electronic equipment, ensure solution robustness against space constraints (vibration, shock, thermal gradients, radiation), coordinate PCB design and component integration, act as technical authority during design reviews, lead R&D projects for innovative packaging solutions
Seniority
Senior, hands-on IC