FAB Engineer
Core
Characterize by-products, drive process improvements, and ensure process alignment to optimize yield and reduce scrap in semiconductor manufacturing.
Role type
Senior IC FAB Engineer (Process & Yield)
Builds
Semiconductor memory and storage solutions
Domain
Semiconductor manufacturing / Process Engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Device Theory, Semiconductor Manufacturing, Statistical Process Control (SPC), Design of Experiments (DOE), Material Characterization, SOP creation, Quality systems, Single wafer clean tool knowledge, Wet bench clean tool knowledge
Preferred skills
Process/Recipe development, Cross-functional collaboration, Vendor collaboration, Mentoring
Technologies
SPC, DOE, FMEA, ECN, GCP, TPM, CIP, SPC metrics, R2R
Responsibilities
Provide potential by-product characterizations and participate in Hazard and Operability Studies; Drive process improvements to enable aggressive yield curves; Identify and reduce Chamber/Tool mismatches; Verify new recipes through buddy check procedures; Implement TPM CIPs and continuously improve FD strategies, SPC metrics, and R2R; Create and maintain step-level FMEA; Perform PDRs and support resolution of process-related issues impacting MOR Availability, Efficiency, and Utilization; Coach and mentor less experienced team members.
Seniority
Mid-Senior, hands-on IC
