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Lead Staff Engineer, ID1 PEE WP Equipment

Boise, ID - Main Site💼 Full-time🗓 2026-06-02 → 2026-07-31

Core

Provide technical and organizational leadership for Equipment Engineering Owners within Fab4 Wet Etch, directing installation, qualification, and sustaining of fab tools to optimize performance and efficiency.

Role type

Senior IC equipment engineering lead (semiconductor manufacturing)

Builds

DRAM manufacturing equipment and next-generation technology processes

Domain

Semiconductor manufacturing / Wet etch equipment

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Wet process equipment installation and troubleshooting, Semiconductor manufacturing processes and equipment integration, Data analysis and SPC, Structured problem-solving (DOE, FMEA, RCA), Project management for equipment installs, Strategic planning and execution

Preferred skills

Advanced analytics and experimental techniques, Cross-functional collaboration with process development teams, Vendor resource management

Technologies

Wet etch tools, SPC software, DOE/FMEA/RCA methodologies

Responsibilities

Set priorities for equipment engineering activities to enable best-in-class DRAM manufacturing, Champion EHS compliance and quality standards across equipment operations, Partner with process development teams and manage vendor resources, Oversee complex equipment projects ensuring timelines and budgets are met, Mentor and guide equipment owners to foster technical growth, Utilize advanced analytics to resolve process and hardware challenges

Seniority

Senior, hands-on IC with leadership responsibilities

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