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Engineer - Metals Adv DRAM

Boise, ID - Main Site💼 Full-time🗓 2026-05-19 → 2026-07-31

Core

Develop and optimize process formulations and equipment specifications for manufacturing advanced memory and storage solutions, focusing on state-of-the-art metals chambers and process roadmaps.

Role type

Process Engineer (Metals/Thin Films)

Builds

Memory and storage solutions (DRAM)

Domain

Semiconductor manufacturing / Materials Science

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Thin film deposition (PVD, CVD), film characterization, thin film and surface analysis (SIMS, XPS, EDS, AFM, SEM), materials physics, material growth mechanisms, device physics, scientific programming (Python, MATLAB, JMP)

Preferred skills

None stated

Technologies

PVD, CVD, SIMS, XPS, EDS, AFM, SEM, Python, MATLAB, JMP

Responsibilities

Develop new or modified process formulations; define processing or handling equipment requirements and specifications; review processing techniques and methods; coordinate design requirement reviews; compile and evaluate test data to determine process limits; conceive and plan projects involving new concepts and equipment automation; work directly with process integration areas (Dry Etch, Wet etch, CVD, Diffusion, Lithography & CMP); own the process roadmap to meet program and yield goals.

Seniority

Mid-level IC

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