Principal Process Engineer - Etch
Core
Develop, support, and continuously improve Reactive Ion Etch (RIE) manufacturing processes for 200mm semiconductor fabrication.
Role type
Principal Process Engineer (Etch)
Builds
200mm semiconductor devices
Domain
Semiconductor manufacturing / Etch
Required skills
Statistical Process Control (SPC), Design of Experiments (DOE), Failure Mode and Effects Analysis (FMEA), 8D problem solving, process qualification, yield optimization, cost reduction, throughput improvement, cleanroom protocols, complex system troubleshooting
Preferred skills
Silicon processing knowledge, cleanroom environment experience, Master's or PhD in relevant engineering/physics discipline
Technologies
RIE modules, 200mm fab equipment
Responsibilities
Drive continuous improvement for throughput, cost, and yield; define and maintain process qualification roadmaps; design and analyze experiments to optimize processes; utilize FMEA to mitigate process change risks; lead hands-on tactical troubleshooting for performance issues; collaborate with integration, equipment, and quality teams.
Seniority
Senior, hands-on IC