CareerPlan

RF Technology Development Epitaxy and Integration Engineer – Principal Engineer

Essex Junction, USFull-time$85k2026-10-12 → 2026-11-10

Core

Develop, evaluate, and qualify CVD Si/SiGe epitaxial processes and FEOL semiconductor devices to meet performance, cost, and yield requirements for RF technologies.

Role type

Principal Epitaxy and Integration Engineer

Builds

RF semiconductor devices and processes

Domain

Semiconductor manufacturing (Foundry)

Required skills

Epitaxial growth techniques (CVD Si/SiGe), FEOL process development, DOE methodologies, statistical analysis, yield learning, device physics, RF fundamentals

Preferred skills

SiGe BiCMOS FEOL/BEOL processing, III-V processing, semiconductor process development, leadership experience, project management

Technologies

CVD, Si, SiGe, III-V, FEOL, BEOL, S-parameters

Responsibilities

Define epitaxial growth conditions and controls, optimize and qualify FEOL devices, drive integration optimization using DOE, partner with failure analysis teams, establish new technology design rules and test methodologies, solve technical process problems

Seniority

Principal, hands-on IC