Sr Assoc Eng Failure Analysis
Core
Perform Transmission Electron Microscopy (TEM) analysis and Focused Ion Beam (FIB) sample preparation to support semiconductor failure analysis and characterization.
Role type
Senior IC failure analysis engineer (TEM/FIB)
Builds
High-quality TEM samples and failure analysis data for semiconductor fabrication teams
Domain
Semiconductor manufacturing / Failure analysis
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
TEM analysis, FIB operation, wafer cleaving, optical microscopy, RIE/polishing, sample coating, defect navigation, EDX analysis, night-shift operations
Preferred skills
Hands-on TEM/FIB experience, semiconductor field knowledge
Technologies
TEM, FIB, RIE, Optical Microscope, EDX
Responsibilities
Operate FIB systems for precision milling and lamella preparation; conduct TEM profiling and measurement; perform pre-FIB sample preparation including delayering and coating; troubleshoot sample preparation challenges under time pressure; support urgent requests from fabrication and failure analysis teams; ensure samples meet quality and thickness requirements
Seniority
Senior, hands-on IC
