CareerPlan

Engineer - Frame Engineering

USA - New York - MaltaFull-time$69k–$120k2026-10-21 → 2026-11-10
On-siteCitizens onlySecurity clearance required

Core

Engineer supporting tape out operations, frame design, and process improvements for semiconductor manufacturing.

Role type

Frame Engineering Engineer (Tape Out)

Builds

Chip tape-out support, frame structures, and manufacturing automation workflows

Domain

Semiconductor manufacturing / Chip fabrication

Required skills

Unix shell scripting, Failure Mode and Effect Analysis (FMEA), structured problem-solving, cross-functional collaboration, process documentation, risk mitigation

Preferred skills

Cadence Mask Compose, Virtuoso environment, SKILL Programming, Device Layout Knowledge, project management

Technologies

Unix, Cadence Mask Compose, Virtuoso, SKILL

Responsibilities

Facilitate technology frame requirements and generate frame structures for chips; Execute ad-hoc changes and prioritize work queues; Decide on escalation or rejection of tape out support issues; Collaborate with FAB and TD teams to improve efficiencies and reduce cycle time; Assess business processes and suggest automation opportunities; Ensure processes are documented with failure mode assessments and mitigation plans.

Seniority

Mid-level, hands-on IC