Quantum Superconducting Interconnect Integration Engineer
Core
Own development and integration of cryogenic, superconducting interconnect and interposer technologies enabling scalable quantum system integration.
Role type
R&D interconnect and interposer integration engineer
Builds
2.5D and 3D cryogenic interposer architectures for quantum systems
Domain
Semiconductor manufacturing / Quantum computing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Superconducting materials and interfaces, Low-temperature material behavior, Wafer-level processes (RDL, TSV/TOV), Die-level integration (bump, bonding), Cryogenic reliability optimization, Low-loss RF/microwave signal propagation, Thermal leakage minimization, Root-cause analysis, Process integration planning, Chiplet-style integration
Preferred skills
Project management, Leadership experience, Innovation in ambiguous environments
Technologies
Nb, Al, In, Superconducting liners, Redistribution layers, 3DHI, TSV/TOV
Responsibilities
Lead development of superconducting interconnect and interposer integration processes, Develop 2.5D and 3D cryogenic interposer architectures, Define routing and metallization schemes for low-loss RF/microwave propagation, Own end-to-end integration of interposer and interconnect flows, Architect and integrate multi-die quantum packaging solutions, Support chiplet-style and system-level integration, Drive process integration planning for prototyping, Identify and drive understanding of failure modes, Lead root-cause analysis and corrective actions, Support system-level validation and characterization at cryogenic conditions, Generate integration flow documentation and process specs
Seniority
Senior, hands-on IC
