Principal Engineer (CMP Module)
Core
Leading the performance, reliability, and capability of Chemical Mechanical Polishing (CMP) equipment to support high-volume manufacturing, technology development, and capacity expansion.
Role type
Principal Engineer (CMP Module)
Builds
High-volume semiconductor manufacturing capacity and differentiated, power-efficient solutions.
Domain
Semiconductor manufacturing / Chemical Mechanical Polishing (CMP) equipment engineering
Deliverable
physical/clinical work
Required skills
CMP equipment hardware expertise, reliability engineering, tool installation and qualification, supplier management, statistical process control (SPC), fault detection and classification (FDC), predictive maintenance, Root Cause Analysis (RCA), 8D problem-solving
Preferred skills
None stated
Technologies
SPC, FDC, predictive maintenance methodologies
Responsibilities
Own end-to-end CMP equipment performance including uptime, reliability, availability, yield impact, and cost of ownership; Lead installation, qualification, and production ramp of new CMP equipment and technology nodes; Drive equipment capability improvement and continuous improvement programs; Lead troubleshooting of complex equipment issues and provide technical leadership during major excursions; Conduct and lead Root Cause Analysis (RCA) and corrective actions; Develop and optimize preventive and corrective maintenance strategies; Partner with Process, Manufacturing, Facilities, Quality, and Supplier Engineering teams; Drive equipment roadmap planning and work with suppliers on hardware upgrades; Establish and standardize equipment engineering best practices and documentation; Mentor junior engineers and serve as the primary technical SME for CMP equipment systems
Seniority
Principal, technical authority & mentorship