Principal Eng Module Engineering
Core
Leading post-equipment PM, tool down recovery qualification, and lot disposition for 24/7 semiconductor manufacturing operations.
Role type
Principal Module Engineering (Photolithography/Metrology)
Builds
Semiconductor manufacturing processes and yield improvements
Domain
Semiconductor manufacturing (Wafer Fab)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
photolithography process troubleshooting, metrology process troubleshooting, process control engineering, data analysis, problem-solving, project management, SPC, OCAP, FDC, RTM, RMS, APC, DOE, FMEA, 8D, Fishbone, Risk Assessment
Preferred skills
photolithography process recipe optimization, metrology process recipe optimization, equipment expertise (Nikon scanners, TEL tracks, Hitachi CDSEM, KLA Archer OVL, EVG/SVG litho tools), defect and yield analysis software
Technologies
Nikon scanners, TEL tracks, Hitachi CDSEM, KLA Archer OVL, Electrical/Optical testers, Thermawave Optiprobe, Rudolph Firefly, KLA defect scanner, Stylus Profilometer, Microscope, Sorter, EVG/SVG litho tools
Responsibilities
Perform post equipment PM and tool down recovery qualification, support 24/7 operation lot disposition, liaise with external vendors for issue escalation, maintain and improve Process KPIs, own process layer improvement projects, coach and train module process personnel
Seniority
Principal, hands-on IC
