Operator III
Core
Performs manufacturing processes to ensure the correct and efficient building and testing of quoted goods and products.
Role type
Manufacturing Operator III
Builds
IC and passive components via manual retinning, degolding, and reballing methods
Domain
Electronics manufacturing / Semiconductor assembly
Required skills
Manual retinning, degolding, reballing, microscopy visual inspection, X-ray equipment operation, XRF equipment operation, solderability testing, ionic contamination testing
Preferred skills
None stated
Technologies
X-Ray equipment, XRF equipment, BGA Simulation equipment, MUST 3 Solderability Testing equipment, Windows-based operating system
Responsibilities
Perform alloy conversion of IC and passive components; conduct microscopy visual inspection; operate X-Ray and XRF equipment; perform solderability and ionic contamination tests; rotate between duties; participate in team activities.
Seniority
Entry-level / Early Career