Repair Team Leader (Repair Specialist II)
Core
Diagnosing, troubleshooting, and repairing electronic products and components to ensure optimal functionality and quality in a manufacturing environment.
Role type
Repair Specialist II (IC)
Builds
Repaired electronic assemblies and components for manufacturing clients
Domain
Electronics manufacturing / Hardware repair
Deliverable
physical/clinical work
Required skills
Soldering (hot air pencil, solder pot), Component removal and replacement (Jlead, Gullwing, SOIC, Through-Hole), Coating removal and touch-up, Schematic reading, Testing equipment operation (multimeters, oscilloscopes), IPC standards knowledge
Preferred skills
Bonding, staking, and RTV repair, Parylene removal, PCB rework assistance
Technologies
Hot air pencil, Solder sucker, Board heater, Solder pot, Multimeters, Oscilloscopes, Spectrum analyzers
Responsibilities
Perform rework tasks including removing and replacing various electronic components; Execute repair procedures according to documentation and schematics; Utilize testing equipment to verify repairs; Document repair activities and test results; Collaborate with engineering and quality teams on recurring issues; Maintain clean workstation and adhere to safety/ESD protocols.
Seniority
Mid-level IC (1-3 years experience)
