SMT Principal Engineer
Core
Technical leadership and subject matter expertise in Surface Mount Technology (SMT) manufacturing processes to drive manufacturing excellence, quality, and throughput.
Role type
Principal SMT Process Engineer
Builds
Advanced electronics manufacturing operations and scalable SMT assembly lines
Domain
Electronics Manufacturing Services (EMS) / Surface Mount Technology
Required skills
SMT process development, equipment optimization, DOE, SPC, CPK analysis, Gage R&R, root cause analysis, NPI support, process documentation, statistical process control, Lean/Six Sigma
Preferred skills
Fuji Pick & Place platform expertise, Six Sigma Black Belt, Minitab, high-reliability electronics manufacturing, global manufacturing operations
Technologies
Fuji Pick & Place, AOI, SPI, reflow ovens, solder paste printing
Responsibilities
Lead SMT equipment selection, programming, validation, and process qualification; Optimize machine performance, placement accuracy, and OEE; Support new product introduction (NPI) activities; Develop and implement process controls; Mentor engineers and technicians; Lead root cause investigations and corrective actions; Establish process documentation and equipment standards.
Seniority
Principal, hands-on IC with strategic leadership
