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Tecnico(a) de analisis de fallas

Guadalajara💼 Full-time🗓 2026-07-17 → 2026-07-30

Core

Investigate component, manufacturing, and field return issues through root cause analysis and corrective actions on electronic circuit board assemblies.

Role type

Technician, Failure Analysis

Builds

Diagnostic reports and corrective actions for engineering teams

Domain

Electronics manufacturing / Hardware reliability

Deliverable

client delivery

Required skills

Root cause analysis, SMT and Thru-hole rework, BGA reballing, grinding and polishing, hazardous chemical handling, failure analysis equipment operation, schematic and BOM interpretation, moisture and shock sensitive component handling, statistical data evaluation

Preferred skills

None stated

Technologies

None stated

Responsibilities

Operate specialized Failure Analysis equipment, perform SMT and Thru-hole rework including BGA reballing, diagnose and repair electronic circuit board assemblies, monitor component reject levels, report technical information on failures to engineers, assist in implementing proactive measures to improve product yields, assist Test Engineering in data evaluation programs, adhere to safety and security policies

Seniority

Individual Contributor, limited supervision

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