Manufacturing Engineer I - Bryan Dairy (2nd Shift)
Core
Develop and implement manufacturing processes and operator instructions for circuit card assemblies (CCAs) and electronic assemblies using Surface Mount (SMT) and Through-Hole (TH) technology.
Role type
Manufacturing Engineer I (Electronics Manufacturing)
Builds
Circuit card assemblies (CCAs) and electronic assemblies
Domain
Electronics Manufacturing Services (EMS)
Required skills
SMT and Through-Hole process design, process flow determination, operator work instruction creation, process tooling design and validation (stencils, wave pallets, jigs, fixtures), soldering profile creation, Bill of Materials management, chemical approval processes, root cause analysis, First Pass Yield (FPY) and Customer Return Rate (CRR) monitoring, changeover optimization, labor capacity modeling
Preferred skills
IPC-610/J-STD-001 Class 3 knowledge, understanding of labor quoting and efficiency
Technologies
SMT, Through-Hole, wave soldering, press-fit, component forming/prep
Responsibilities
Design and develop processes to meet product and customer requirements; Create operator work instructions for automated and manual processes; Design, order, and validate process tooling; Monitor key metrics such as CRR, FPY, and Scrap; Aid production floor in resolving Man/Method/Machine/Material/Measurement/Environment issues; Provide guidance and training to Manufacturing Engineering Assistants and Technicians; Assist Project Engineers with capacity modeling and labor quoting.
Seniority
Junior to Mid-level, hands-on IC
