Field Application NTP Project lead Chitose
Core
Local project lead and application engineer supporting Node Transition Projects (NTP) for new node devices, providing tailored solutions, performing technical analysis on overlay/imaging data, and driving workstreams to meet customer performance requirements.
Role type
Senior IC project lead / application engineer (semiconductor)
Builds
New semiconductor node devices (EUV, DUV, YS, VCP)
Domain
Semiconductor manufacturing / Lithography
Required skills
Data analysis, problem solving, project management, technical reporting, troubleshooting, presentation skills, English communication, Japanese communication
Preferred skills
Experience in overlay/imaging analysis, user-friendly documentation creation
Technologies
EUV, DUV, YS, VCP, MS Excel, PowerPoint
Responsibilities
Perform technical analysis on overlay/imaging data, examine results and connect to suitable solutions, collaborate with HQ overlay/imaging experts, communicate with internal/external customers, present analysis results to external customers, support engineering activities for node transition projects, drive workstreams and manage reporting for stakeholders
Seniority
Senior, hands-on IC with project lead responsibilities