Director - Field Application Engineering (EMEA)
Core
Lead Field Application Engineering for hardware AI inference platforms (Metis™) across EMEA, supporting OEMs, integrators, and end users in industrial automation, automotive, and robotics.
Role type
Director, Field Application Engineering (Hardware/Embedded Systems)
Builds
Metis™ AI Platform (PCIe boards, compute modules) for Edge AI inference
Domain
Semiconductor hardware, Embedded Systems, AI Inference, Industrial Automation
Deliverable
production ML models | product features | infrastructure
Required skills
Embedded board design, Chip-down development, Custom carrier board design, ARM-based SoCs, Embedded AI workloads, High-speed digital interfaces, Signal integrity, Power sequencing, Thermal design, Embedded Linux/BSP, Hardware/software integration debugging, AI accelerators/NPUs/GPUs
Preferred skills
Yocto/Buildroot/Debian, PCIe enumeration, Production validation, Manufacturing bring-up, EMEA OEM/ODM ecosystem relationships
Technologies
Metis™, PCIe, ARM SoCs, Embedded Linux, Voyager SDK
Responsibilities
Lead hardware bring-up and board integration on-site/remotely, Drive pre-sales engagement and design wins, Build FAE processes and recruit/mentor regional team, Surface customer feedback to Product/R&D, Represent company at EMEA industry events
Seniority
Director, Regional Leadership & Hands-on IC
