Technical Program Manager, Thermal & Mechanical Engineering
Core
Lead thermal, mechanical, and advanced board-assembly development programs from requirements through production ramp, connecting package, board, cooling, and chassis integration.
Role type
Senior IC Technical Program Manager (Thermal & Mechanical Engineering)
Builds
Next-gen processors, cooling solutions, and server/GPU hardware
Domain
Semiconductor hardware, electronic packaging, thermal management
Required skills
Program scope definition, integrated schedule management, cross-functional coordination, risk assessment, supplier management (CMs/ODMs/OSATs), DFM/DFA reviews, manufacturing handover, root-cause analysis (8D, FMEA), phase-gate management
Preferred skills
Thermal/mechanical hardware experience, electronic packaging/NPI, SMT processes, large BGA assembly, package-to-system heat path analysis, DOE, high-performance computing/GPU/server programs, liquid/air cooling, PMP, Power BI, SQL, Python
Technologies
SMT, BGA, TIMs, Power BI, SQL, Python
Responsibilities
Define program scope, milestones, owners, and acceptance criteria; Coordinate package, board, and chassis interfaces; Lead execution reviews with suppliers; Plan engineering and validation builds; Manage risks, issues, and engineering changes; Drive DFM/DFA reviews and manufacturing handover
Seniority
Senior, hands-on IC
