CareerPlan

Thermal Mechanical Systems Design Lead

Taipei, TaiwanFull-time2026-10-16 → 2026-10-22

Core

Lead thermal and mechanical design validation for AMD server/datacenter platforms, working directly with OEM/ODM customers to enable deployment of high-performance computing systems.

Role type

Senior IC thermal mechanical systems design lead

Builds

Server and datacenter platforms (CPU/GPU) with advanced cooling solutions

Domain

Semiconductor hardware / Datacenter infrastructure / Thermal engineering

Required skills

Thermal/mechanical design and analysis, System architecture, Power measurement, CFD simulation, CAD design, Test instrumentation, Debugging, Technical training

Preferred skills

Rack-level mechanical architecture, Liquid/immersion cooling technologies, OCP/DC-MHS architectures, Cross-functional leadership, Problem-solving

Technologies

Solidworks, Flotherm, Ansys Icepak, BMC, ODM/OEM platforms

Responsibilities

Perform thermal and mechanical modeling and testing of components and systems, Conduct thermal and power measurements for model validation, Provide technical training and support to OEM/ODM customers, Lead discussions on architecture and performance optimization, Investigate advanced thermal technologies (vapor chamber, liquid cooling), Execute on-site support for issue closure

Seniority

Senior, hands-on IC