2027 Undergrad Thermal Engineering Intern/Co-Op
Core
Thermal Engineering intern supporting the development of advanced cooling technologies for AI, high-performance computing, and data center platforms.
Role type
Undergraduate Thermal Engineering Intern
Builds
Advanced cooling solutions for AI and HPC platforms
Domain
Semiconductor manufacturing / Thermal management
Required skills
Heat transfer, thermodynamics, fluid mechanics, thermal-fluid systems, thermal management solutions, liquid cooling technologies, laboratory testing, instrumentation, sensors, data acquisition, CAD software, CFD software, thermal simulation tools
Preferred skills
AI infrastructure exposure, high-performance computing systems, server technologies, energy-efficient cooling technologies
Technologies
SolidWorks, Creo, ANSYS Icepak, Fluent, FloTHERM, COMSOL, OpenFOAM
Responsibilities
Perform thermal and hydraulic characterization of cooling solutions, evaluate air-cooled and liquid-cooled platforms, support laboratory testing and instrumentation setup, develop scripts for test automation, conduct thermal modeling and simulation, investigate thermal and flow issues, document technical findings
Seniority
Undergraduate Intern
