SW SYSTEMS ENGINEER 10139 - Layer2 & Layer 3 Forwarding Development- BCM Chipset
Core
Develop Layer 2 and Layer 3 forwarding components for BCM chipsets, focusing on data plane performance and routing algorithms.
Role type
Senior IC systems engineer (networking data plane)
Builds
High-performance networking chipsets (BCM XGS & DNX family)
Domain
Networking hardware / Semiconductor
Deliverable
production ML models | product features
Required skills
C programming, Linux embedded development, L2/L3 forwarding concepts, VXLAN, MCT, ACL, QoS, routing algorithms, data structures, memory leak debugging, performance optimization
Preferred skills
BCM chipset programming, microservices architecture, multi-site team collaboration
Technologies
BCM XGS, BCM DNX, Linux, C
Responsibilities
Implement and deliver complete components/modules for L2/L3 forwarding, debug memory leaks and performance bottlenecks, optimize data plane forwarding logic
Seniority
Senior, hands-on IC
