Senior Hardware Technical Lead, Interconnect Systems
Core
Own end-to-end technical program execution of complex Co-Packaged Optics (CPO) and Silicon Photonics (SiPho) interconnect hardware from concept through mass production.
Role type
Senior individual contributor hardware technical lead (electro-optical systems)
Builds
Advanced CPO and interconnect test solutions for high-speed electro-optical devices powering next-generation AI data centers
Domain
Hardware engineering, electro-optics, silicon photonics, AI data center infrastructure
Required skills
Hardware system engineering, electro-optical characterization, technical program management, cross-functional leadership, electrical/optical debug and failure analysis, Python scripting, test automation, hardware control interfaces (I2C, SPI, JTAG), DFM/DFT guidelines
Preferred skills
Co-Packaged Optics system integration, silicon photonics device characterization, opto-mechanical design, collaboration with overseas manufacturing partners
Technologies
Python, JMP, oscilloscopes, spectrum analyzers, OPMs, BER testers, source meters
Responsibilities
Drive full program lifecycle from requirements through HVM; act as technical focal point across parallel workstreams; mentor engineers and conduct design reviews; consolidate requirements into a plan of record; define and execute validation and coverage strategy; perform hands-on electrical and optical debug and failure analysis; develop scripting and automation solutions; partner with manufacturing to build robust test solutions
Seniority
Senior, hands-on IC with leadership dimension
