CareerPlan

Thermal Engineer

Israel, YokneamFull-time2026-06-01 → 2026-11-10

Core

Designing advanced thermal cooling solutions for high-speed communication devices and next-generation NVIDIA products.

Role type

Thermal Engineer (Hardware)

Builds

Thermal cooling solutions for networking and communication hardware

Domain

Semiconductor / Networking / Hardware

Required skills

Thermodynamics, Fluid mechanics, Heat transfer, FEA/CFD theory, Thermal simulation software (IcePak, FloTHERM, Fluent), PCB/boards thermal modeling, DOE design, Liquid-cooling design

Preferred skills

Manufacturing process knowledge, Design of experiments (DOE), Liquid-cooling thermal solutions

Technologies

IcePak, FloTHERM, Fluent

Responsibilities

Design conduction/convection based thermal solutions, Perform thermal simulation analysis, Develop thermal designs for hardware components

Seniority

Mid-level, hands-on IC