CareerPlan

Manager, Mechanical Engineering

Israel, YokneamFull-time2026-04-14 → 2026-11-10

Core

Lead the development of next-generation cooling and mechanical solutions for high-speed communication systems and advanced AI/networking infrastructure.

Role type

Senior IC mechanical engineering manager (thermal systems)

Builds

Next-generation thermal/mechanical solutions for NVIDIA networking products

Domain

Semiconductor cooling, high-power electronics, liquid cooling, thermal management

Required skills

Mechanical design, thermal analysis, liquid cooling technologies, materials science, soldering technologies, manufacturing processes, cross-functional leadership, system-level thinking (chip to rack)

Preferred skills

Advanced TIM direction, new technology enablement, manufacturability balancing

Technologies

Liquid cooling systems, structural simulation tools, thermal analysis software

Responsibilities

Manage and lead teams of 15+ engineers across mechanical analysis, design, and materials; Direct R&D activities for mechanical design, analysis, and manufacturing processes; Support designs of advanced thermal solutions for next-generation products

Seniority

Senior, hands-on IC with leadership