Sr. Process Engineer - Wafer Level Assembly, AI Satellites (Starmind)
Core
Own the full lifecycle of advanced packaging through board assembly process development for high-performance electrical compute hardware and solar power systems for orbital AI satellites.
Role type
Senior IC process engineer (wafer level assembly & advanced packaging)
Builds
Custom compute electronics, memory, networking, and power systems for on-orbit AI data centers
Domain
Aerospace / Satellite manufacturing / Advanced packaging
Deliverable
production ML models | product features | infrastructure
Required skills
board assembly process development, materials selection, prototyping, process optimization, manufacturing, failure analysis, equipment specification, supply chain management, in-process metrology, simulation integration, process R&D, compliance risk management, mentorship
Preferred skills
hardware/robotics/automation manufacturing experience, tooling/fixture/jig design, scripting/data analysis (MATLAB/JMP), precision assemblies, robotic systems, automated pick-and-place, manufacturing methodologies (PFMEA/SPC), GD&T, MES/traceability, cleanroom practices
Technologies
board assembly, pick-and-place equipment, MES, simulation tools, metrology tools
Responsibilities
Own full lifecycle of advanced packaging and board assembly process development; Own full lifecycle of equipment specification, qualification, and ramp; Build supply chains for components and equipment; Specify and implement in-process metrology tools; Drive end-to-end process R&D programs; Mentor and develop engineers; Manage compliance risks
Seniority
Senior, hands-on IC with mentorship responsibilities
