Sr. Packaging Engineer - Thermal Materials, AI Satellites (Starmind)
Core
Design, build, and operate the orbital compute fabric for Starmind, a satellite constellation powering on-orbit AI inference and data center workloads.
Role type
Senior IC packaging engineer (thermal materials & microelectronics)
Builds
High-performance electrical compute hardware, solar power systems, thermal radiators, and custom compute electronics for space-based AI.
Domain
Aerospace / Satellite Systems / Thermal Engineering / Microelectronics Packaging
Deliverable
production ML models | product features | infrastructure
Required skills
microelectronics device research, manufacturing process development, materials selection, failure analysis, thermal solution design, supply chain management, equipment qualification, compliance risk management, mentorship
Preferred skills
hardware/robotics/automation experience, tooling/fixture design, scripting/data analysis (MATLAB/JMP), precision assembly, GD&T, MES/traceability systems, cleanroom practices
Technologies
TIMs, PFMEA, SPC, GD&T, MES
Responsibilities
Own full lifecycle of advanced packaging from requirements to manufacturing; drive system trades and materials selection; develop integrated thermal solutions; manage equipment specification and supply chains; collaborate with cross-functional teams; ensure safety and environmental compliance; mentor engineers.
Seniority
Senior, hands-on IC with mentorship responsibilities