CareerPlan

Senior Java Engineering Lead (Payments Technology) — Vice President

TAMPA, Florida, United States of AmericaFull-time$114k2026-09-18 → 2026-11-10
Hybrid

Core

Architect, build, and evolve global payment processing platforms and microservices at a major financial institution.

Role type

Senior IC engineering lead (payments technology)

Builds

High-throughput, low-latency microservices for global payment transactions

Domain

Financial services / Payments

Deliverable

production ML models | product features

Required skills

Java, Spring Boot, Microservices, Domain-Driven Design, Event-driven architecture, Kafka/RabbitMQ, Docker, Kubernetes, CI/CD, Relational databases, NoSQL

Preferred skills

AI-powered developer tools, AI/ML in production, Chaos Engineering, Site Reliability Engineering, Financial payment standards (SWIFT, ISO 20022)

Technologies

Java, Spring Boot, Kafka, RabbitMQ, Docker, Kubernetes, Oracle, MongoDB, Resilience4j, Hystrix, Dynatrace, Splunk, Chaos Monkey, Gremlin

Responsibilities

Lead end-to-end delivery of critical payment applications; Design and build high-throughput microservices; Champion modern architectural patterns; Mentor and guide cross-functional engineering teams; Integrate AI-powered developer tooling; Architect systems for 99.99%+ availability; Define and own SLAs/SLOs/SLIs and lead Chaos Engineering; Collaborate with stakeholders to translate requirements into technical solutions

Seniority

Senior, hands-on IC with leadership