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Android BSP Engineer

Taiwan Locations💼 Full-time🗓 2026-07-21 → 2026-07-31

Core

Kernel and driver level system development for Android on embedded payments platforms, focusing on hardware bring-up, peripheral drivers, and performance optimization.

Role type

Senior IC Android BSP Engineer

Builds

Embedded payment terminals and POS hardware

Domain

Fintech / Embedded Systems / Mobile Hardware

Deliverable

production ML models | product features | infrastructure

Required skills

Device driver development, Embedded systems, Operating systems (Android/Linux/RTOS), C/C++, Kotlin/Java, Automated testing, Inter-component communication protocols (UART/GPIO/SPI/I2C), Telemetry data analysis

Preferred skills

ARM platform, Microcontrollers, EMV, Cryptography, PCI technology, POS Hardware

Technologies

Android, Linux, RTOS, C, C++, Kotlin, Java, UART, GPIO, SPI, I2C

Responsibilities

Bring up new devices and lead debugging/performance tuning, Design and maintain drivers for constrained environments, Own work streams for hardware bring-up and power management, Analyze bug reports and manage defect resolution, Perform code reviews, Collaborate with QA to ensure test case execution

Seniority

Senior, hands-on IC

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